is an electrical grade Kapton alternative polyamide film coated with a high performance silicone adhesive. Thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures. Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of circuit boards during processing. Excellent resistance to acids, oils, solvents, aging, staining, water immersion. Protects gold contacts from molten solder during hot air wave solder leveling process.